Synthesis and Characterization of Core/shell Silica Nanoparticles for Chemical Mechanical Planarization of Low-k Dielectric and Copper Wafers

Download or read book Synthesis and Characterization of Core/shell Silica Nanoparticles for Chemical Mechanical Planarization of Low-k Dielectric and Copper Wafers written by Kannan Balasundaram and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: Monodispersed core/shell silica particles with a hard core and microporous shell have been synthesized by surfactant template method. Ca. 75nm silica particles were used as core and Cetyltrimethylammonium bromide (C16TAB) as template for generating microporous shell. Concentration of the surfactant was varied and the growth of porous shell analyzed using high-resolution transmission electron microscopy and nitrogen adsorption. TGA and FTIR were used to confirm the surfactant removal after heat treatment. The synthesized particles were monodispersed and had a hard core and highly microporous shell with pore size in the range of 1.3-2.2nm and total pore volume in the range of 0.57-0.77cm3/g. The Chemical mechanical Planarization (CMP) performance of core/shell silica particles were analyzed and compared with that of core silica particles. Polishing was done on copper wafers and low-k dielectric material such as black diamond. The core/shell silica particles produced higher removal rates and better surface finish for both the wafers. Spectral reflectance technique and atomic force microscopy (AFM) were used as analyzing tool.