High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

Download or read book High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method written by Sofie Burger and published by KIT Scientific Publishing. This book was released on 2014-05-19 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.