System-in-Package

System-in-Package
Author :
Publisher : Now Publishers Inc
Total Pages : 93
Release :
ISBN-10 : 9781601984586
ISBN-13 : 1601984588
Rating : 4/5 (86 Downloads)

Book Synopsis System-in-Package by : Lei He

Download or read book System-in-Package written by Lei He and published by Now Publishers Inc. This book was released on 2011-06-20 with total page 93 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.


System-in-Package Related Books

SiP System-in-Package Design and Simulation
Language: en
Pages: 508
Authors: Suny Li (Li Yang)
Categories: Technology & Engineering
Type: BOOK - Published: 2017-07-24 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design
System on Package
Language: en
Pages: 807
Authors: Rao Tummala
Categories: Technology & Engineering
Type: BOOK - Published: 2007-07-22 - Publisher: McGraw Hill Professional

DOWNLOAD EBOOK

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bul
System-in-Package
Language: en
Pages: 93
Authors: Lei He
Categories: Computers
Type: BOOK - Published: 2011-06-20 - Publisher: Now Publishers Inc

DOWNLOAD EBOOK

Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the s
SiP System-in-Package Design and Simulation
Language: en
Pages: 507
Authors: Suny Li (Li Yang)
Categories: Technology & Engineering
Type: BOOK - Published: 2017-07-12 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design
Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz
Language: en
Pages: 254
Authors: Bhutani, Akanksha
Categories: Technology & Engineering
Type: BOOK - Published: 2019-10-17 - Publisher: KIT Scientific Publishing

DOWNLOAD EBOOK