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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Language: en
Pages: 344
Authors: Ephraim Suhir
Categories: Technology & Engineering
Type: BOOK - Published: 2021-01-28 - Publisher: CRC Press

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the und
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Language: en
Pages: 344
Authors: Ephraim Suhir
Categories: Failure analysis (Engineering)
Type: BOOK - Published: 2020 - Publisher:

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"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of
Solder Joint Reliability
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Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

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Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
Lead-Free Electronic Solders
Language: en
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Authors: KV Subramanian
Categories: Technology & Engineering
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Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in elect
Fundamentals of Lead-Free Solder Interconnect Technology
Language: en
Pages: 266
Authors: Tae-Kyu Lee
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech