This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafe

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the mos

This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding T

Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such di