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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004
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The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and
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Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863
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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 20
Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects
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