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3D IC Integration and Packaging
Language: en
Pages: 480
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2015-08-27 - Publisher: McGraw-Hill Education

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A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for in
3D IC Integration and Packaging
Language: en
Pages: 481
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2015-07-06 - Publisher: McGraw Hill Professional

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A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for inc
Design And Modeling For 3d Ics And Interposers
Language: en
Pages: 379
Authors: Madhavan Swaminathan
Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific

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3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
3D Integration for VLSI Systems
Language: en
Pages: 376
Authors: Chuan Seng Tan
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Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press

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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
Handbook of 3D Integration, Volume 1
Language: en
Pages: 798
Authors: Philip Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r